Tong Hsing Electronics Phils. Inc. is one of the leading IC Hybrid assembly houses specializing on Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Products and Ceramic Assembly manufacturing using Thick Film and DPC process. Clean room environment ranges from class 10, 100, 1000, 10K and 100K.
To ensure continuous improvement and to satisfy customer expectations, Tong Hsing Electronics Phils. Inc. adheres to the International Quality Assurance standard model of Quality System Requirements:
Assembly Technologies
Packaging Technologies
Thick Film Technologies
Thin Film / DPC Technologies
The Company has different ways to appreciate and recognize their employee’s achievement. Company events are done quarterly to promote and reward employees success and hard work. Recognizing the milestones of each employee wherein they are given medals, plaque and other tangible rewards.
Employee’s showing continues improvement or contribution to the organization is being acknowledge by presenting them rewards.
Applicants who passed the assessment shall proceed to next step which is the Job Offer. During process the Recruitment Team discussed offered position and salary and company benefits to the successful applicants.
After the assessment/interviews of the qualified applicants, HRD Manager with the support of the Hiring Department will spend an ample amount of time reviewing the application and their qualifications before taking next steps.
So you may have to wait a few days to hear whether you're going to receive a job offer or if the company is moving forward with another candidate